先进陶瓷基板、超薄光学玻璃、人工晶体、特殊金属、有机材料等经超精密抛光工艺加工，均量产小于 0.1mm 厚度薄片，可为半导体、光电、微电子行业提供标准化超薄基材方案。

Ultra-precision polishing is applied to advanced ceramic substrates, ultra-thin optical glass and synthetic crystals, all of which can be mass-produced into sheets thinner than 0.1 mm, supplying standardized ultra-thin substrate solutions for the semiconductor, optoelectronic and microelectronics industries.